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Arm Shows Backside Power Delivery as Path to Further Moore’s Law

People often think that Moore’s Law is all about making smaller and smaller transistors. But these days, a lot of the difficulty is squeezing in the tangle of interconnects needed to get signals and power to them. Those smaller, more dense interconnects are more resistive, leading to a potential waste of power. At the IEEE International Electron Devices Meeting in December, Arm engineers presented a processor design that demonstrates a way to reduce the density of interconnects and deliver power to chips with less waste.